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Please use this identifier to cite or link to this item: http://mitustr.lib.mitust.edu.tw:8080/ir/handle/987654321/1111

Title: Studies of Fluorine-Containing Bismaleimide Resins Part I: Synthesis and Characteristics of Model Compounds
Authors: 疏偉傑
Wang, Zen-You
Ho, Jiau-Ching
Shu, Wei-Jye
Keywords: fluorine-containing bismaleimide resins
low-k materials
dielectric constant
Date: 2010-12
Issue Date: 2014-12-29 15:43:22 (UTC+8)
Abstract: A series of fluorine-containing bismaleimide(FBMI) monomers are synthesized by a 3-step reaction for using as the applications of low-k materials. The synthesized FBMI monomers are characterized by the 1H,13C, 19F nuclear magnetic resonance (NMR) spectroscopy and element analysis. These FBMI monomers react with free radical initiator or self-cure to prepare FBMI-polymers. All the self-curing FBMI resins have the glass transition temperatures (Tg) in the range of 128–141C and show the 5% weight loss temperatures (T5%) of 235–293C in nitrogen atmosphere. The higher heat resistance of selfcuring FBMI resin relative to FBMI-homopolymer is due to its higher crosslinking density. The FBMI resins exhibit improved dielectric properties as compared with commercial bismaleimide (BMI) resins with the dielectric constants(Dk) lower than 2.49, which is related to the low polarizability of the CAF bond and the large free volume of CF3 groups in the polymers. Besides, the flame retardancy of all these FBMI resins could be enhanced via the introduction of Br-atom.
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